Welcome to our Thermal Interface Materials product page. Here you will find materials for all your needs. Please contact us for help by our experts engineering@prosperelectronics.com.
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| Part Number | Datasheet | Type | Thermal Conductivity | Benefits | |
|---|---|---|---|---|---|
| PTY-120 | Datasheet |  |
Gap pad (silicone) | 1,2 w/mK |
• Thermal conductivity up to 1.5 W/m K (ASTM 5470) • High temperature resistance • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-150 | Datasheet | |
Gap pad (silicone) | 1,5 w/mK. |
• Thermal conductivity up to 1.5 W/m K (ASTM 5470) • High temperature resistance • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-200 | Datasheet |  |
Gap pad (silicone) | 2,0 w/mK. |
• Thermal conductivity from 2 to 5 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-300 | Datasheet | |
Gap pad (silicone) | 3,0 w/mK. |
• Thermal conductivity from 2 to 5 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-400 | Datasheet | |
Gap pad (silicone) | 4,0 w/mK. |
• Thermal conductivity from 2 to 5 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-500 | Datasheet | |
Gap pad (silicone) | 5,0 w/mK. |
• Thermal conductivity from 2 to 5 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-600 | Datasheet | |
Gap pad (silicone) | 6,0 w/mK. |
• Thermal conductivity from 6 to 9 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-700 | Datasheet | |
Gap pad (silicone) | 7,0 w/mK. |
• Thermal conductivity from 6 to 9 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-800 | Datasheet | |
Gap pad (silicone) | 8,0 w/mK. |
• Thermal conductivity from 6 to 9 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-900 | Datasheet | |
Gap pad (silicone) | 9,0 w/mK. |
• Thermal conductivity from 6 to 9 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-1000 | Datasheet | |
Gap pad (silicone) | 10,0 w/mK. |
• Thermal conductivity from 10 to 12 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-1100 | Datasheet | |
Gap pad (silicone) | 11,0 w/mK. |
• Thermal conductivity from 10 to 12 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-1200 | Datasheet | |
Gap pad (silicone) | 12,0 w/mK. |
• Thermal conductivity from 13 to 15 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-1300 | Datasheet | |
Gap pad (silicone) | 13,0 w/mK. |
• Thermal conductivity from 13 to 15 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-1400 | Datasheet | |
Gap pad (silicone) | 14,0 w/mK. |
• Thermal conductivity from 13 to 15 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PTY-1500 | Datasheet | |
Gap pad (silicone) | 15,0 w/mK. |
• Thermal conductivity from 13 to 15 W/m K (ASTM 5470) • High thermal performance, low thermal impedance • Soft and flexible, reducing the interface thermal resistance • High electrical insulation to protect electronic devices • Self-adhesive, easy to assemble, reworkable • Flame-retardant UL 94-V0 • Easy to die-cut |
| PT1-200 | Datasheet | |
One component gap filler | 2,0 w/mK. |
• High thermal performance, low thermal resistance, excellent wettability; • Soft, low stress, protects fragile electronic components • Excellent compressibility, infinitely compresses, down to 0.1mm; • No settlement, no flow, can fill the gaps of irregular components • Syringe packaging, automatic dispensing can adjust any thickness and shape. |
| PT1-300 | Datasheet | |
One component gap filler | 3,0 w/mK. |
• High thermal performance, low thermal resistance, excellent wettability; • Soft, low stress, protects fragile electronic components • Excellent compressibility, infinitely compresses, down to 0.1mm; • No settlement, no flow, can fill the gaps of irregular components • Syringe packaging, automatic dispensing can adjust any thickness and shape. |
| PT1-380 | Datasheet | |
One component gap filler | 3,8 w/mK. |
• High thermal performance, low thermal resistance, excellent wettability; • Soft, low stress, protects fragile electronic components • Excellent compressibility, infinitely compresses, down to 0.1mm; • No settlement, no flow, can fill the gaps of irregular components • Syringe packaging, automatic dispensing can adjust any thickness and shape. |
| PT1-500 | Datasheet | |
One component gap filler | 5,0 w/mK. |
• High thermal performance, low thermal resistance, excellent wettability; • Soft, low stress, protects fragile electronic components • Excellent compressibility, infinitely compresses, down to 0.1mm; • No settlement, no flow, can fill the gaps of irregular components • Syringe packaging, automatic dispensing can adjust any thickness and shape. |
| PT2-100 | Datasheet | |
Two component gap filler | 1,0 w/mK. |
• High thermal performance, low thermal impedance, excellent wettability • Ultra-conforming, designed for fragile and low-stress applications • Low viscosity and easy to dispense • Automatic dispensing can adjust any thickness and shape, can fill irregular components • Comes with slight tack surface, used in thermal interface applications when a strong adhesion is not required |
| PT2-200 | Datasheet | |
Two component gap filler | 2,0 w/mK. |
• High thermal performance, low thermal impedance, excellent wettability • Ultra-conforming, designed for fragile and low-stress applications • Low viscosity and easy to dispense • Automatic dispensing can adjust any thickness and shape, can fill irregular components • Comes with slight tack surface, used in thermal interface applications when a strong adhesion is not required |
| PT2-300 | Datasheet | |
Two component gap filler | 3,0 w/mK. |
• High thermal performance, low thermal impedance, excellent wettability • Ultra-conforming, designed for fragile and low-stress applications • Low viscosity and easy to dispense • Automatic dispensing can adjust any thickness and shape, can fill irregular components • Comes with slight tack surface, used in thermal interface applications when a strong adhesion is not required |
| PT2-380 | Datasheet | |
Two component gap filler | 3,8 w/mK. |
• High thermal performance, low thermal impedance, excellent wettability • Ultra-conforming, designed for fragile and low-stress applications • Low viscosity and easy to dispense • Automatic dispensing can adjust any thickness and shape, can fill irregular components • Comes with slight tack surface, used in thermal interface applications when a strong adhesion is not required |
| PT2-500 | Datasheet | |
Two component gap filler | 5,0 w/mK. |
• High thermal performance, low thermal impedance, excellent wettability • Ultra-conforming, designed for fragile and low-stress applications • Low viscosity and easy to dispense • Automatic dispensing can adjust any thickness and shape, can fill irregular components • Comes with slight tack surface, used in thermal interface applications when a strong adhesion is not required |