Thermal Interface Materials

Welcome to our Thermal Interface Materials product page. Here you will find materials for all your needs. Please contact us for help by our experts engineering@prosperelectronics.com.

Part Number Datasheet Type Description Benefits
PTY-001 Datasheet Gap pad (silicone) PTY-001 is a 2,5 W/mK, ultra-soft, silicone gap filler formulated to conform to component topography with little or no stress on components. This results in a low thermal impedance and superior heat transfer. Ultra-low deflection force
Low thermal impedance
Naturally tacky
Manufacturing friendly
High dielectric breakdown voltage
PTY-002 Datasheet Gap pad (silicone) PTY-002 is a 5 W/mk, , silicone-based gap filler, formulated to easily conform to component topography with little or no stress. This results in a lower thermal impedance and superior heat transfer. Economical combination of thermal performance and conformability
Low thermal impedance
Can be over-moulded
High dielectric breakdown voltage
PTY-003 Datasheet Gap pad (silicone) PTY-003 is a 12 W/mk, silicone-based gap filler, formulated for the most demanding of heat transfer applications. TY-003 can be supplied either as standard sheets or manufacturing-friendly die-cut parts. High thermal conductivity
Low thermal impedance
High dielectric breakdown voltage
Industry-best heat transfer
PTY-004 Datasheet Gap pad (non-silicone) PTY-004 is a 2.5 W/mk, soft, non-silicone pad designed for applications sensitive to silicone out-gassing. Its low hardness allows it to conform to surfaces which further reduces the thermal impedance and enhances heat transfer. Unique, silicone-free technology
Naturally tacky for ease of manufacture
Available as standard sheets or die cut parts
High dielectric breakdown strength
PTY-005 Datasheet Putty (non-silicone) PTY-005 is a 4.5 W/mk non-silicone thermal putty which provides low thermal impedance over rough topographies. TY-005 deflects easily under very low compression forces which decreases the stress on delicate components. Unique, silicone-free technology
Easily dispensable
Fully cured
No-pump out
Low thermal impedance
Reworkable
PTY-SP-007 Datasheet Putty (silicone) PTY-SP-007 is a silicone-based, thermally conductive grease. Formulated to ease manufacture and have a low viscosity it is suitable for screen-printing or stencilling. PTY-SP-007 is stable up to 180°C. Economic combination of price and performance
Easily applied
High temperature stability
Low thermal impendence
Non-pump out
PTY-SFP-45 Datasheet Silicone Free Thremal Putty PTY-SFP-45 is a 4.5 W/mK silicone free thermopaste / thermal putty, which provides a low thermal impedance over rough topographies. PTY-SFP-45 defects easily under very low compression forces which decreases the stress on delicate components. Silicone free
Easily dispensable
Fully cured
Non-pump out
Low thermal impedance
Reworkable
TIMS-8000 Series Datasheet Gap pad (silicone free) The TIMS-8000 series are thermally conductive interface pads with a high thermal conductivity of up 2 W/mK. These pads are designed to provide a preferential heat transfer path away from heat generating components. The very soft acrylic composition allows a low load during compression and provides a tacky surface for optimal contact to any surface. Their non-silicone bases makes them ideal for automotive and electronic applications. Silicone free
High termal conductivity
Soft acrylic composition
Tacky surface
TIMS-9000 Series Datasheet Gap pad (silicone free) The TIMS-9000 series are thermally conductive interface pads with a high thermal conductivity of up 3 W/mK. These pads are designed to provide a preferential heat transfer path away from heat generating components. The very soft acrylic composition allows a low load during compression and provides a tacky surface for optimal contact to any surface. Their non-silicone bases makes them ideal for automotive and electronic applications. Silicone free
High termal conductivity
Soft acrylic composition
Tacky surface