Discover our high-performance non-silicone Thermal Interface Materials (TIMs), engineered for superior thermal management in demanding electronic applications. Available in a variety of thermal conductivities, these TIMs provide efficient heat transfer while maintaining stability under high temperatures and long-term operation.

Non-silicone TIMs offer several advantages over silicone-based materials, including lower outgassing, improved mechanical robustness, and enhanced compatibility with sensitive electronic components. They are ideal for applications requiring minimal contamination, higher operating temperatures, or long-term reliability under thermal cycling.

Available in standard sheets or precision die-cut formats, these materials ensure optimal contact and minimal thermal resistance for CPUs, power modules, LEDs, and other high-power devices. Perfect for industrial, telecom, and consumer electronics, our non-silicone TIMs deliver durable, high-performance thermal solutions where reliability and efficiency are critical.